Automatic chip bonding at Philips Photonics showing a VCSEL wafer. (Image courtesy of TRUMPF) Philips Photonics, the laser diode division of Philips and a provider of vertical cavity surface-emitting laser (VCSEL) devices, needed an equipment solution for wafer cleaning. In semiconductor manufacturing, the wafer cleaning process is a critical step. The most common wafer cleaning process is the RCA process, which involves several solvent cleaning steps to remove metal residues and other contamin…
Source URL: New Machine Automates VCSEL Wafer Cleaning Process
Source Website: Advance Engineering – Engineering.com