Balluff introduces BOH00EZ wafer mapping sensor

Based on photoelectric Micromote technology, it features an LED sensor in a sensor head measuring 2.4 x 1.5 x 7 mm. Especially designed for use with thin end effectors, it features a controlled and focused light spot, allowing it to detect wafers a few μm thick.


Source URL: Balluff introduces BOH00EZ wafer mapping sensor

Source Website: Factory Automation – Automation.com

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