Based on photoelectric Micromote technology, it features an LED sensor in a sensor head measuring 2.4 x 1.5 x 7 mm. Especially designed for use with thin end effectors, it features a controlled and focused light spot, allowing it to detect wafers a few μm thick.
Source URL: Balluff introduces BOH00EZ wafer mapping sensor
Source Website: Factory Automation – Automation.com
