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Nordson MARCH announces RollVIA plasma system

The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.



Source URL: Nordson MARCH announces RollVIA plasma system

Source Website: Factory Automation – Automation.com
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